American chip manufacturer, Qualcomm could launch its next flagship Mobile Platform earlier than expected. According to leaked images of a poster, the company has scheduled an event for December this year and is expected to announce its next flagship Mobile Platform — Snapdragon 845 — there.
The SD845 will be manufactured using a 10nm process, and will utilise 4 Cortex-A75 high performance cores, and four Cortex-A535 high efficiency cores along with the Adreno 630 GPU.
The Snapdragon 845 could also feature the X20 modem which will give it the ability to support downlink speeds up to 1.2Gbps. There are rumours that Samsung has reserved the first batch of SD845 chipsets for its flagship Galaxy S9 coming out next year, but there are reports suggesting that the Xiaomi Mi 7 could also be the first smartphone to come with a Snapdragon 845 under the hood.
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